Inventor
LEE HANG LIM
KR3 patents
Patents
3 patentsUS9620476B2Apr 11, 2017
Bonding head and die bonding apparatus having the same
SEMES CO LTD6 citations62
US12327810B2Jun 10, 2025
Die surface treatment apparatus and die bonding system including the same
SEMES CO LTD0 citations59
US12506113B2Dec 23, 2025
Method of bonding a semiconductor die to a wafer
SEMES CO LTD0 citations43