Inventor
WANG YUCHUN
US32 patents
⚠️ This page may combine multiple inventors who share the name “WANG YUCHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6537144B1Mar 25, 2003
Method and apparatus for enhanced CMP using metals having reductive properties
APPLIED MATERIALS INC145 citations99
US6899804B2May 31, 2005
Electrolyte composition and treatment for electrolytic chemical mechanical polishing
APPLIED MATERIALS INC77 citations98
US6569349B1May 27, 2003
Additives to CMP slurry to polish dielectric films
APPLIED MATERIALS INC92 citations98
US6561873B2May 13, 2003
Method and apparatus for enhanced CMP using metals having reductive properties
APPLIED MATERIALS INC66 citations96
US6783432B2Aug 31, 2004
Additives for pressure sensitive polishing compositions
APPLIED MATERIALS INC19 citations93
US6520840B1Feb 18, 2003
CMP slurry for planarizing metals
APPLIED MATERIALS INC25 citations93
US6435944B1Aug 20, 2002
CMP slurry for planarizing metals
APPLIED MATERIALS INC23 citations93
US7066800B2Jun 27, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC31 citations92
US6988942B2Jan 24, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC41 citations92
US6657726B1Dec 2, 2003
In situ measurement of slurry distribution
APPLIED MATERIALS INC20 citations92
US6638143B2Oct 28, 2003
Ion exchange materials for chemical mechanical polishing
APPLIED MATERIALS INC41 citations92
US6572453B1Jun 3, 2003
Multi-fluid polishing process
APPLIED MATERIALS INC25 citations92
US6872329B2Mar 29, 2005
Chemical mechanical polishing composition and process
APPLIED MATERIALS INC15 citations84
US7137879B2Nov 21, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC7 citations74
US8012000B2Sep 6, 2011
Extended pad life for ECMP and barrier removal
APPLIED MATERIALS INC2 citations61
US7344432B2Mar 18, 2008
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
APPLIED MATERIALS INC3 citations60
US7311592B2Dec 25, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC1 citations52
US9496190B2Nov 15, 2016
Feedback of layer thickness timing and clearance timing for polishing control
APPLIED MATERIALS INC1 citations51
CABOT MICROELECTRONICS CORP
3 patentsUS7091604B2Aug 15, 2006
Three dimensional integrated circuits
CABOT MICROELECTRONICS CORP35 citations91
US6984587B2Jan 10, 2006
Integrated polishing and electroless deposition
CABOT MICROELECTRONICS CORP0 citations52
US7955519B2Jun 7, 2011
Composition and method for planarizing surfaces
CABOT MICROELECTRONICS CORP0 citations50
ASM NUTOOL INC
3 patentsUS6942546B2Sep 13, 2005
Endpoint detection for non-transparent polishing member
ASM NUTOOL INC23 citations91
US6857947B2Feb 22, 2005
Advanced chemical mechanical polishing system with smart endpoint detection
ASM NUTOOL INC43 citations90
US6926589B2Aug 9, 2005
Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
ASM NUTOOL INC0 citations49