Inventor

BAJAJ RAJEEV

US112 patents

⚠️ This page may combine multiple inventors who share the name “BAJAJ RAJEEV”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAJAJ RAJEEV

APPLIED MATERIALS INC

Method and apparatus for enhanced CMP using metals having reductive properties

Chemical mechanical polishing of a metal layer with polishing rate monitoring

Additives to CMP slurry to polish dielectric films

CMP pad construction with composite material properties using additive manufacturing processes

Apparatus for printing a chemical mechanical polishing pad

Apparatus for printing a chemical mechanical polishing pad

Method and apparatus for enhanced CMP using metals having reductive properties

Apparatus and method of forming a polishing pads by use of an additive manufacturing process

Advanced polishing pad materials and formulations

Apparatus for forming a polishing article that has a desired zeta potential

CMP pad construction with composite material properties using additive manufacturing processes

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Porous chemical mechanical polishing pads

Advanced polishing pads having compositional gradients by use of an additive manufacturing process

Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

Printing a chemical mechanical polishing pad

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Polishing pads produced by an additive manufacturing process

Additives for pressure sensitive polishing compositions

CMP slurry for planarizing metals

CMP slurry for planarizing metals

Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects

Ion exchange materials for chemical mechanical polishing

Optical monitoring in a two-step chemical mechanical polishing process

Optical monitoring in a two-step chemical mechanical polishing process

Selective damascene chemical mechanical polishing

Post CU CMP polishing for reduced defects

Piezo-electric end-pointing for 3D printed CMP pads

MOTOROLA INC

Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers

Process for polishing a semiconductor device substrate

Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture

Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor

Processing for polishing dissimilar conductive layers in a semiconductor device

Method of chemical mechanical planarization using a water rinse to prevent particle contamination

Method for polishing a semiconductor wafer using dynamic control

Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects

Method for using a conductive tungsten nitride etch stop layer to form conductive interconnects and tungsten nitride contact structure

BAJAJ RAJEEV

Printed chemical mechanical polishing pad

Polishing pad

Polishing pad with homogeneous body having discrete protrusions thereon

Polishing pad with endpoint window and systems and method using the same

Polishing pad composition

Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance

SEMIQUEST INC

Method and apparatus for improved chemical mechanical planarization and CMP pad

Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor

Electro-chemical mechanical planarization pad with uniform polish performance

LAM RES CORP

Wafer polishing device with movable window

Wafer polishing device with movable window

(unassigned)

Polishing pad with reduced moisture absorption