Inventor
LEE HYO SOO
KR7 patents
⚠️ This page may combine multiple inventors who share the name “LEE HYO SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
4 patentsUS7346982B2Mar 25, 2008
Method of fabricating printed circuit board having thin core layer
SAMSUNG ELECTRO MECH26 citations91
US7414317B2Aug 19, 2008
BGA package with concave shaped bonding pads
SAMSUNG ELECTRO MECH12 citations82
US7829985B2Nov 9, 2010
BGA package having half-etched bonding pad and cut plating line and method of fabricating same
SAMSUNG ELECTRO MECH7 citations72
US7298887B2Nov 20, 2007
System for and method of analyzing surface condition of PCB using RGB colors
SAMSUNG ELECTRO MECH0 citations40