Inventor
OKA TAKAHIRO
JP43 patents
⚠️ This page may combine multiple inventors who share the name “OKA TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHISSO CORP
16 patentsUS6355725B2Mar 12, 2002
Propylene-ethylene block copolymer compositions and processes for production thereof
CHISSO CORP62 citations95
US6211300B1Apr 3, 2001
Propylene-ethylene block copolymer compositions and processes for production thereof
CHISSO CORP57 citations95
US5532325AJul 2, 1996
Process for producing high stiffness polypropylene
CHISSO CORP23 citations92
US5461115AOct 24, 1995
Continuous production process of a propylene-ethylene block copolymer
CHISSO CORP25 citations92
US4582878AApr 15, 1986
High-rigidity ethylene-propylene copolymer and process for producing same
CHISSO CORP20 citations81
US4970280ANov 13, 1990
Continuous process for producing high molten viscoelastic polypropylene or ethylene-propylene copolymer
CHISSO CORP12 citations73
US4771103ASep 13, 1988
Process for continuously producing propylene-ethylene block copolymer
CHISSO CORP19 citations73
US4760113AJul 26, 1988
Process for continuously producing a high-melt viscoelastic ethylene-propylene copolymer
CHISSO CORP18 citations73
US4500682AFeb 19, 1985
High melt-viscoelastic polypropylene for post-processed sheets and for blow molding
CHISSO CORP16 citations73
US4550144AOct 29, 1985
Propylene-ethylene copolymers for high-rigidity molded products and process for producing the same
CHISSO CORP16 citations72
US4522994AJun 11, 1985
Polypropylene resin for high-rigidity molded products
CHISSO CORP14 citations72
US4510292AApr 9, 1985
Ethylene-propylene copolymers for foaming and process for producing the same
CHISSO CORP20 citations72
US4499247AFeb 12, 1985
High-rigidity, high-melt-viscoelasticity polypropylene and process for producing the same
CHISSO CORP12 citations72
US5672658ASep 30, 1997
Highly stiff propylene-ethylene block copolymer composition and a process for producing the same
CHISSO CORP9 citations71
US5140062AAug 18, 1992
Continuous process for producing high molten viscoelastic polypropylene of ethylene-propylene copolymer
CHISSO CORP5 citations62
US5854355ADec 29, 1998
Continuous process for preparation of highly rigid propylene-ethylene block copolymers
CHISSO CORP6 citations60
OKI ELECTRIC IND CO LTD
11 patentsUS6551906B2Apr 22, 2003
Method of fabricating semiconductor device
OKI ELECTRIC IND CO LTD71 citations96
US6472729B1Oct 29, 2002
Semiconductor device
OKI ELECTRIC IND CO LTD29 citations92
US6174751B1Jan 16, 2001
Method of manufacturing resin encapsulated semiconductor device
OKI ELECTRIC IND CO LTD41 citations92
US6084300AJul 4, 2000
Compact resin-sealed semiconductor device
OKI ELECTRIC IND CO LTD34 citations92
US7075177B2Jul 11, 2006
Semiconductor chip package
OKI ELECTRIC IND CO LTD11 citations84
US7211883B2May 1, 2007
Semiconductor chip package
OKI ELECTRIC IND CO LTD7 citations74
US6831354B2Dec 14, 2004
Semiconductor package and method of fabricating same
OKI ELECTRIC IND CO LTD7 citations74
US7067357B2Jun 27, 2006
Semiconductor package and method of fabricating same
OKI ELECTRIC IND CO LTD4 citations63
US6777264B2Aug 17, 2004
Method of manufacturing a semiconductor device having a die pad without a downset
OKI ELECTRIC IND CO LTD3 citations63
US6512287B1Jan 28, 2003
Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus
OKI ELECTRIC IND CO LTD3 citations63
US6948239B2Sep 27, 2005
Method for fabricating semiconductor apparatus using board frame
OKI ELECTRIC IND CO LTD0 citations52
MURATA MANUFACTURING CO
6 patentsUS11230499B2Jan 25, 2022
Ceramic electronic component
MURATA MANUFACTURING CO0 citations60
US10292264B2May 14, 2019
Insulating ceramic paste, ceramic electronic component, and method for producing the same
MURATA MANUFACTURING CO0 citations49
US9974168B2May 15, 2018
Insulating ceramic paste, ceramic electronic component, and method for producing the same
MURATA MANUFACTURING CO0 citations49
US10638603B2Apr 28, 2020
Multilayer ceramic substrate
MURATA MANUFACTURING CO0 citations48
US10485099B2Nov 19, 2019
Multilayer ceramic substrate
MURATA MANUFACTURING CO0 citations48
US11350523B2May 31, 2022
Ceramic wiring board and method for producing the same
MURATA MANUFACTURING CO0 citations47