Inventor
PALUDA PATRICK M
US4 patents
Patents
4 patentsUS7393772B2Jul 1, 2008
Wirebond structure and method to connect to a microelectronic die
INTEL CORP10 citations81
US7855103B2Dec 21, 2010
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6924554B2Aug 2, 2005
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6683383B2Jan 27, 2004
Wirebond structure and method to connect to a microelectronic die
INTEL CORP11 citations71