Inventor

HAMA Setsuya

JP2 patents

Patents

2 patents

US10600677B2Mar 24, 2020

Method for manufacturing bonded SOI wafer

SHINETSU HANDOTAI KK2 citations65

US11244852B2Feb 8, 2022

Method for manufacturing bonded SOI wafer

SHINETSU HANDOTAI KK0 citations44