P

Inventor

SAITO YOSHINOBU

JP50 patents
⚠️ This page may combine multiple inventors who share the name “SAITO YOSHINOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DISCO CORP

32 patents
US12094742B2Sep 17, 2024

Processing apparatus

DISCO CORP3 citations74
US11935778B2Mar 19, 2024

Holding mechanism including Bernoulli pad

DISCO CORP3 citations73
US11862505B2Jan 2, 2024

Processing apparatus

DISCO CORP2 citations73
US11715664B2Aug 1, 2023

Holding mechanism

DISCO CORP2 citations73
US11651988B2May 16, 2023

Processing apparatus

DISCO CORP3 citations73
US11443951B2Sep 13, 2022

Resin protection member forming apparatus

DISCO CORP2 citations73
US11474143B2Oct 18, 2022

Testing apparatus

DISCO CORP2 citations69
US11764085B2Sep 19, 2023

Processing apparatus

DISCO CORP2 citations68
US12253458B2Mar 18, 2025

Dryness detection method and dryness detection apparatus

DISCO CORP0 citations62
US11756809B2Sep 12, 2023

Tape attaching apparatus

DISCO CORP1 citations62
US11222806B2Jan 11, 2022

Tape, tape attaching method, and tape expanding method

DISCO CORP0 citations62
US11162881B2Nov 2, 2021

Test apparatus

DISCO CORP0 citations62
US11090921B2Aug 17, 2021

Peeling method of resin sheet

DISCO CORP0 citations62
US12298126B2May 13, 2025

Operation accuracy measuring method

DISCO CORP0 citations61
US11554455B2Jan 17, 2023

Processing apparatus

DISCO CORP0 citations61
US11545386B2Jan 3, 2023

Workpiece unit

DISCO CORP1 citations61
US11437267B2Sep 6, 2022

Workpiece unit including adhesive tape with color change layer

DISCO CORP0 citations61
US12463028B2Nov 4, 2025

Method of processing wafer

DISCO CORP0 citations60
US12522522B2Jan 13, 2026

Processing wafer regeneration equipment

DISCO CORP0 citations52
US12431370B2Sep 30, 2025

Reinforcement portion processing apparatus

DISCO CORP0 citations52
US12151339B2Nov 26, 2024

Grinding wheel and wafer grinding method

DISCO CORP0 citations52
US12100620B2Sep 24, 2024

Wafer processing method and machine

DISCO CORP0 citations52
US11664248B2May 30, 2023

Resin sheet fixing apparatus

DISCO CORP0 citations52
US11460354B2Oct 4, 2022

Table

DISCO CORP0 citations52
US11456214B2Sep 27, 2022

Method of processing workpiece

DISCO CORP0 citations52
US11325284B2May 10, 2022

Protective member forming method

DISCO CORP0 citations52
US11402310B2Aug 2, 2022

Measuring apparatus for measuring a flexural strength of a test piece

DISCO CORP0 citations51
US11923223B2Mar 5, 2024

Apparatus and method for detecting a wafer in a cassette

DISCO CORP0 citations50
US12308276B2May 20, 2025

Tape pressure bonding apparatus

DISCO CORP0 citations49
US12417938B2Sep 16, 2025

Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape

DISCO CORP0 citations48
US12322638B2Jun 3, 2025

Processing apparatus

DISCO CORP0 citations48
US12208984B2Jan 28, 2025

Tape affixing apparatus

DISCO CORP0 citations48

P & PF CO LTD

5 patents

SHISEIDO CO LTD

2 patents

TOHOKU SPECIAL STEEL WORKS LTD

2 patents

NISHINA TETSUO

2 patents

SAITO YOSHINOBU

1 patent

TODA TOMOKO

1 patent

RES INST IRON STEEL

1 patent

SHISEIDO HONEYCAKE CO LTD

1 patent

SHISEIDO HONECAKE INDUSTRY CO

1 patent

TOHOKU STEEL

1 patent

NAGURA SHOGO

1 patent