Inventor
ALUR AMRUTHAVALLI
US6 patents
Patents
6 patentsUS11430724B2Aug 30, 2022
Ultra-thin, hyper-density semiconductor packages
INTEL CORP5 citations83
US12476174B2Nov 18, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US12406914B2Sep 2, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US12336196B2Jun 17, 2025
Magnetic core inductors on package substrates
INTEL CORP1 citations61
US11676950B2Jun 13, 2023
Via-in-via structure for high density package integrated inductor
INTEL CORP0 citations61
US11508636B2Nov 22, 2022
Multi-layer solution based deposition of dielectrics for advanced substrate architectures
INTEL CORP0 citations59