Inventor
AJOIAN JACK
US4 patents
Patents
4 patentsUS9085826B2Jul 21, 2015
Method of fabricating printed circuit board (PCB) substrate having a cavity
AVAGO TECHNOLOGIES GENERAL IP2 citations54
US9907169B1Feb 27, 2018
Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB
AVAGO TECHNOLOGIES GENERAL IP0 citations39
US9832865B2Nov 28, 2017
Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards
AVAGO TECHNOLOGIES GENERAL IP0 citations36
US9668340B1May 30, 2017
Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boards
AVAGO TECHNOLOGIES GENERAL IP0 citations32