Inventor
ZHU BAO
CN7 patents
⚠️ This page may combine multiple inventors who share the name “ZHU BAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV FUDAN
4 patentsUS12159179B2Dec 3, 2024
Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof
UNIV FUDAN0 citations50
US11887912B2Jan 30, 2024
Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof
UNIV FUDAN0 citations50
US11881442B2Jan 23, 2024
SOI active transfer board for three-dimensional packaging and preparation method thereof
UNIV FUDAN0 citations50
US11854939B2Dec 26, 2023
Three-dimensional integrated system of dram chip and preparation method thereof
UNIV FUDAN0 citations50
SHANGHAI INTEGRATED CIRCUIT MFG INNOVATION CENTER CO LTD
2 patentsUS12543327B2Feb 3, 2026
On-chip all-solid-state supercapacitor and preparation method thereof
SHANGHAI INTEGRATED CIRCUIT MFG INNOVATION CENTER CO LTD0 citations48
US12198980B2Jan 14, 2025
Metal interconnection structure and manufacturing method thereof
SHANGHAI INTEGRATED CIRCUIT MFG INNOVATION CENTER CO LTD0 citations48