Inventor
TSAI KAO-TSAIR
TW18 patents
Patents
18 patentsUS6509137B1Jan 21, 2003
Multilayer photoresist process in photolithography
WINBOND ELECTRONICS CORP33 citations92
US7598155B1Oct 6, 2009
Method of manufacturing an overlay mark
WINBOND ELECTRONICS CORP11 citations82
US6544695B2Apr 8, 2003
Photomask set for photolithographic operation
WINBOND ELECTRONICS CORP9 citations73
US6465160B1Oct 15, 2002
Method for preventing side-lobes in photolithography
WINBOND ELECTRONICS CORP7 citations73
US6413685B1Jul 2, 2002
Method of reducing optical proximity effect
WINBOND ELECTRONICS CORP7 citations65
US8022560B2Sep 20, 2011
Overlay mark
WINBOND ELECTRONICS CORP4 citations61
US6791668B2Sep 14, 2004
Semiconductor manufacturing apparatus and method
WINBOND ELECTRONICS CORP3 citations61
US12588198B2Mar 24, 2026
Pick-up structure of memory device and method for manufacturing memory device
WINBOND ELECTRONICS CORP0 citations57
US7223527B2May 29, 2007
Immersion lithography process, and structure used for the same and patterning process
WINBOND ELECTRONICS CORP4 citations54
US12148627B2Nov 19, 2024
Method for forming semiconductor memory structure
WINBOND ELECTRONICS CORP0 citations51
US11818884B2Nov 14, 2023
Method for manufacturing non-volatile memory device
WINBOND ELECTRONICS CORP0 citations51
US7008729B2Mar 7, 2006
Method for fabricating phase mask of photolithography process
WINBOND ELECTRONICS CORP0 citations50
US12119261B2Oct 15, 2024
Semiconductor structure and manufacturing method of the same
WINBOND ELECTRONICS CORP0 citations49
US11990365B2May 21, 2024
Method for manufacturing semiconductor device
WINBOND ELECTRONICS CORP0 citations48
US11798185B2Oct 24, 2023
Image analysis system and image analysis method for obtaining object range
WINBOND ELECTRONICS CORP0 citations48
US10615046B2Apr 7, 2020
Methods of forming semiconductor devices with flowable material for better planarization method
WINBOND ELECTRONICS CORP0 citations47
US9773842B2Sep 26, 2017
Memory devices
WINBOND ELECTRONICS CORP1 citations46
US10658320B1May 19, 2020
Semiconductor device including conductive structure
WINBOND ELECTRONICS CORP0 citations40