Inventor
NELSON JERIMY
US16 patents
Patents
16 patentsUS6769102B2Jul 27, 2004
Verifying proximity of ground metal to signal traces in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO51 citations92
US7078812B2Jul 18, 2006
Routing differential signal lines in a substrate
HEWLETT PACKARD DEVELOPMENT CO13 citations83
US6922822B2Jul 26, 2005
Verifying proximity of ground vias to signal vias in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO14 citations83
US7075185B2Jul 11, 2006
Routing vias in a substrate from bypass capacitor pads
HEWLETT PACKARD DEVELOPMENT CO14 citations82
US6907589B2Jun 14, 2005
System and method for evaluating vias per pad in a package design
HEWLETT PACKARD DEVELOPMENT CO16 citations82
US7117464B2Oct 3, 2006
System and method for evaluating signal coupling between differential traces in a package design
HEWLETT PACKARD DEVELOPMENT CO16 citations79
US6938230B2Aug 30, 2005
System and method for evaluating signal trace discontinuities in a package design
HEWLETT PACKARD DEVELOPMENT CO10 citations73
US6807657B2Oct 19, 2004
Inter-signal proximity verification in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO11 citations73
US7069095B2Jun 27, 2006
System and method for populating a computer-aided design program's database with design parameters
HEWLETT PACKARD DEVELOPMENT CO9 citations72
US7143022B1Nov 28, 2006
System and method for integrating subcircuit models in an integrated power grid analysis environment
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US7143389B2Nov 28, 2006
Systems and methods for generating node level bypass capacitor models
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7055124B2May 30, 2006
System and method for evaluating signal deviations in a package design
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7327583B2Feb 5, 2008
Routing power and ground vias in a substrate
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7137088B2Nov 14, 2006
System and method for determining signal coupling coefficients for lines
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7272806B2Sep 18, 2007
System and method for evaluating power and ground vias in a package design
HEWLETT PACKARD DEVELOPMENT CO4 citations60
US7326860B2Feb 5, 2008
Routing vias in a substrate from bypass capacitor pads
HEWLETT PACKARD DEVELOPMENT CO1 citations50