P

Inventor

FRANK MARK D

US24 patents

Patents

24 patents
US6983434B1Jan 3, 2006

Differential via pair impedance adjustment tool

HEWLETT PACKARD DEVELOPMENT CO48 citations92
US6976233B1Dec 13, 2005

Signal via impedance verification tool

HEWLETT PACKARD DEVELOPMENT CO19 citations92
US6971077B1Nov 29, 2005

Signal line impedance adjustment tool

HEWLETT PACKARD DEVELOPMENT CO25 citations92
US6859915B1Feb 22, 2005

Signal line impedance verification tool

HEWLETT PACKARD DEVELOPMENT CO30 citations92
US6845492B1Jan 18, 2005

Signal via impedance adjustment tool

HEWLETT PACKARD DEVELOPMENT CO25 citations92
US6769102B2Jul 27, 2004

Verifying proximity of ground metal to signal traces in an integrated circuit

HEWLETT PACKARD DEVELOPMENT CO51 citations92
US7078812B2Jul 18, 2006

Routing differential signal lines in a substrate

HEWLETT PACKARD DEVELOPMENT CO13 citations83
US6968522B1Nov 22, 2005

Differential line pair impedance verification tool

HEWLETT PACKARD DEVELOPMENT CO12 citations83
US6922822B2Jul 26, 2005

Verifying proximity of ground vias to signal vias in an integrated circuit

HEWLETT PACKARD DEVELOPMENT CO14 citations83
US6889367B1May 3, 2005

Differential via pair impedance verification tool

HEWLETT PACKARD DEVELOPMENT CO17 citations83
US7075185B2Jul 11, 2006

Routing vias in a substrate from bypass capacitor pads

HEWLETT PACKARD DEVELOPMENT CO14 citations82
US6907589B2Jun 14, 2005

System and method for evaluating vias per pad in a package design

HEWLETT PACKARD DEVELOPMENT CO16 citations82
US6711730B2Mar 23, 2004

Synthesizing signal net information from multiple integrated circuit package models

HEWLETT PACKARD DEVELOPMENT CO17 citations81
US7117464B2Oct 3, 2006

System and method for evaluating signal coupling between differential traces in a package design

HEWLETT PACKARD DEVELOPMENT CO16 citations79
US6983433B1Jan 3, 2006

Differential line pair impedance adjustment tool

HEWLETT PACKARD DEVELOPMENT CO9 citations73
US6938230B2Aug 30, 2005

System and method for evaluating signal trace discontinuities in a package design

HEWLETT PACKARD DEVELOPMENT CO10 citations73
US6807657B2Oct 19, 2004

Inter-signal proximity verification in an integrated circuit

HEWLETT PACKARD DEVELOPMENT CO11 citations73
US7069095B2Jun 27, 2006

System and method for populating a computer-aided design program's database with design parameters

HEWLETT PACKARD DEVELOPMENT CO9 citations72
US7143389B2Nov 28, 2006

Systems and methods for generating node level bypass capacitor models

HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7055124B2May 30, 2006

System and method for evaluating signal deviations in a package design

HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7327583B2Feb 5, 2008

Routing power and ground vias in a substrate

HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7137088B2Nov 14, 2006

System and method for determining signal coupling coefficients for lines

HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7272806B2Sep 18, 2007

System and method for evaluating power and ground vias in a package design

HEWLETT PACKARD DEVELOPMENT CO4 citations60
US7326860B2Feb 5, 2008

Routing vias in a substrate from bypass capacitor pads

HEWLETT PACKARD DEVELOPMENT CO1 citations50