Inventor
MOLDAUER PETER SHAW
US11 patents
Patents
11 patentsUS6769102B2Jul 27, 2004
Verifying proximity of ground metal to signal traces in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO51 citations92
US7078812B2Jul 18, 2006
Routing differential signal lines in a substrate
HEWLETT PACKARD DEVELOPMENT CO13 citations83
US6922822B2Jul 26, 2005
Verifying proximity of ground vias to signal vias in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO14 citations83
US7075185B2Jul 11, 2006
Routing vias in a substrate from bypass capacitor pads
HEWLETT PACKARD DEVELOPMENT CO14 citations82
US6711730B2Mar 23, 2004
Synthesizing signal net information from multiple integrated circuit package models
HEWLETT PACKARD DEVELOPMENT CO17 citations81
US6807657B2Oct 19, 2004
Inter-signal proximity verification in an integrated circuit
HEWLETT PACKARD DEVELOPMENT CO11 citations73
US7327583B2Feb 5, 2008
Routing power and ground vias in a substrate
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US6861912B1Mar 1, 2005
Oscillator method and apparatus for a test chip
HEWLETT PACKARD DEVELOPMENT CO2 citations60
US6788135B1Sep 7, 2004
Terminating pathway for a clock signal
HEWLETT PACKARD DEVELOPMENT CO4 citations57
US7203043B2Apr 10, 2007
Method and structure for external control of ESD protection in electronic circuits
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7326860B2Feb 5, 2008
Routing vias in a substrate from bypass capacitor pads
HEWLETT PACKARD DEVELOPMENT CO1 citations50