Inventor
NOGAWA JUN
JP4 patents
Patents
4 patentsUS6786392B2Sep 7, 2004
Wire bonding device and wire bonding method
NEC ELECTRONICS CORP17 citations79
US7370786B2May 13, 2008
Bonding method and bonding apparatus
NEC ELECTRONICS CORP5 citations71
US6932262B2Aug 23, 2005
Bonding method and bonding apparatus
NEC ELECTRONICS CORP7 citations71
US6669076B2Dec 30, 2003
Wire bonding device
NEC ELECTRONICS CORP11 citations69