Inventor
INOMATA TERUJI
JP4 patents
Patents
4 patentsUS7554191B2Jun 30, 2009
Semiconductor device having a heatsink plate with bored portions
NEC ELECTRONICS CORP7 citations71
US7370786B2May 13, 2008
Bonding method and bonding apparatus
NEC ELECTRONICS CORP5 citations71
US6932262B2Aug 23, 2005
Bonding method and bonding apparatus
NEC ELECTRONICS CORP7 citations71
US6814274B2Nov 9, 2004
Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method
NEC ELECTRONICS CORP1 citations50