Inventor
MIYAZAKI KUNIHIRO
JP40 patents
⚠️ This page may combine multiple inventors who share the name “MIYAZAKI KUNIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
17 patentsUS6832616B2Dec 21, 2004
Substrate treating apparatus
TOSHIBA KK18 citations92
US6444047B1Sep 3, 2002
Method of cleaning a semiconductor substrate
TOSHIBA KK24 citations92
US5686314ANov 11, 1997
Surface processing method effected for total-reflection X-ray fluorescence analysis
TOSHIBA KK40 citations92
US5497407AMar 5, 1996
Contaminating-element analyzing method
TOSHIBA KK28 citations92
US5457726AOct 10, 1995
Analyzer for total reflection fluorescent x-ray and its correcting method
TOSHIBA KK26 citations92
US5430786AJul 4, 1995
Element analyzing method
TOSHIBA KK22 citations92
US6645876B2Nov 11, 2003
Etching for manufacture of semiconductor devices
TOSHIBA KK12 citations73
US5490194AFeb 6, 1996
Method and apparatus for analyzing contaminative element concentrations
TOSHIBA KK7 citations73
US5422925AJun 6, 1995
Contaminating-element analyzing method and apparatus of the same
TOSHIBA KK12 citations73
US5636256AJun 3, 1997
Apparatus used for total reflection fluorescent X-ray analysis on a liquid drop-like sample containing very small amounts of impurities
TOSHIBA KK11 citations69
US7141120B2Nov 28, 2006
Manufacturing apparatus of semiconductor device having introducing section and withdrawing section
TOSHIBA KK2 citations63
US7902030B2Mar 8, 2011
Manufacturing method for semiconductor device and semiconductor device
TOSHIBA KK3 citations62
US5528648AJun 18, 1996
Method and apparatus for analyzing contaminative element concentrations
TOSHIBA KK5 citations62
US7439183B2Oct 21, 2008
Method of manufacturing a semiconductor device, and a semiconductor substrate
TOSHIBA KK0 citations52
US7850818B2Dec 14, 2010
Method of manufacturing semiconductor device and cleaning apparatus
TOSHIBA KK0 citations51
US7635601B2Dec 22, 2009
Method of manufacturing semiconductor device and cleaning apparatus
TOSHIBA KK1 citations51
US7875527B2Jan 25, 2011
Manufacturing method for semiconductor device and semiconductor device
TOSHIBA KK0 citations50
SHOWA DENKO KK
7 patentsUS4902649AFeb 20, 1990
Hard tissue substitute composition
SHOWA DENKO KK72 citations96
US4954141ASep 4, 1990
Polishing pad for semiconductor wafers
SHOWA DENKO KK194 citations94
US4915710AApr 10, 1990
Abrasive composition and process for polishing
SHOWA DENKO KK43 citations92
US4929257AMay 29, 1990
Abrasive composition and process for polishing
SHOWA DENKO KK31 citations88
US4935039AJun 19, 1990
Abrasive composition and process for polishing plastic article
SHOWA DENKO KK22 citations81
US4883502ANov 28, 1989
Abrasive composition and process for polishing
SHOWA DENKO KK8 citations73
US4774068ASep 27, 1988
Method for production of mullite of high purity
SHOWA DENKO KK3 citations59
SHIBAURA MECHATRONICS CORP
4 patentsUS10281210B2May 7, 2019
Substrate processing apparatus and substrate processing method
SHIBAURA MECHATRONICS CORP4 citations72
US11670522B2Jun 6, 2023
Processing liquid generator and substrate processing apparatus using the same
SHIBAURA MECHATRONICS CORP0 citations51
US10406566B2Sep 10, 2019
Substrate processing device and substrate processing method
SHIBAURA MECHATRONICS CORP0 citations50
US9966282B2May 8, 2018
Substrate processing apparatus and substrate processing method
SHIBAURA MECHATRONICS CORP0 citations41
EBARA CORP
3 patentsSEIKO EPSON CORP
2 patentsUS7365012B2Apr 29, 2008
Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus
SEIKO EPSON CORP2 citations62
US7875557B2Jan 25, 2011
Semiconductor substrate treating method, semiconductor component and electronic appliance
SEIKO EPSON CORP1 citations52