Inventor · disambiguated record
Shuhua Zhou
Also filed as: ZHOU SHUHUA
4 granted patents·4 pending applications·0 citations·filing 2019–2025
55Inventor score
Top patents by PatentIndex Score
8 records- 0166US11784141B2Semiconductor package having thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Oct 10, 2023·0 cites·18 claims
- 0264US12243808B2Chip scale package (CSP) semiconductor device having thin substrateALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Mar 4, 2025·0 cites·17 claims
- 0364US2025174524A1Chip scale package (csp) semiconductor device having thin substrateALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 0460US2025070049A1Semiconductor rigid chip-scale package and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 0559US11495548B2Semiconductor package having thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
- 0659US2025070069A1Semiconductor package having high metal bumps and ultra-thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 0758US2025323108A1Semiconductor package having ultra-thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 0844US10663997B2Electronic device circuit boardSHANNON SYSTEMS LTD·Filed 2019·Granted May 26, 2020·0 cites·15 claims
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