Inventor
GRIMBERGEN MICHAEL N
US28 patents
⚠️ This page may combine multiple inventors who share the name “GRIMBERGEN MICHAEL N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
22 patentsUS6712927B1Mar 30, 2004
Chamber having process monitoring window
APPLIED MATERIALS INC119 citations99
US6390019B1May 21, 2002
Chamber having improved process monitoring window
APPLIED MATERIALS INC186 citations99
US6081334AJun 27, 2000
Endpoint detection for semiconductor processes
APPLIED MATERIALS INC251 citations98
US6406924B1Jun 18, 2002
Endpoint detection in the fabrication of electronic devices
APPLIED MATERIALS INC93 citations97
US6824813B1Nov 30, 2004
Substrate monitoring method and apparatus
APPLIED MATERIALS INC33 citations90
US9805939B2Oct 31, 2017
Dual endpoint detection for advanced phase shift and binary photomasks
APPLIED MATERIALS INC6 citations84
US6534756B1Mar 18, 2003
Ultra-stable, compact, high intensity fiber-coupled light source for use in monitoring and process control
APPLIED MATERIALS INC15 citations84
US8017029B2Sep 13, 2011
Plasma mask etch method of controlling a reactor tunable element in accordance with the output of an array of optical sensors viewing the mask backside
APPLIED MATERIALS INC7 citations83
US8002946B2Aug 23, 2011
Mask etch plasma reactor with cathode providing a uniform distribution of etch rate
APPLIED MATERIALS INC8 citations83
US7976671B2Jul 12, 2011
Mask etch plasma reactor with variable process gas distribution
APPLIED MATERIALS INC20 citations83
US7967930B2Jun 28, 2011
Plasma reactor for processing a workpiece and having a tunable cathode
APPLIED MATERIALS INC11 citations83
US7520999B2Apr 21, 2009
Method of processing a workpiece in a plasma reactor with dynamic adjustment of the plasma source power applicator and the workpiece relative to one another
APPLIED MATERIALS INC16 citations83
US7504041B2Mar 17, 2009
Method of processing a workpiece in a plasma reactor employing a dynamically adjustable plasma source power applicator
APPLIED MATERIALS INC13 citations83
US11022877B2Jun 1, 2021
Etch processing system having reflective endpoint detection
APPLIED MATERIALS INC2 citations72
US12007686B2Jun 11, 2024
Etch processing system having reflective endpoint detection
APPLIED MATERIALS INC0 citations62
US8012366B2Sep 6, 2011
Process for etching a transparent workpiece including backside endpoint detection steps
APPLIED MATERIALS INC3 citations62
US7431797B2Oct 7, 2008
Plasma reactor with a dynamically adjustable plasma source power applicator
APPLIED MATERIALS INC2 citations62
US7419551B2Sep 2, 2008
Plasma reactor with apparatus for dynamically adjusting the plasma source power applicator and the workpiece relative to one another
APPLIED MATERIALS INC4 citations62
US12066639B2Aug 20, 2024
Adjustable achromatic collimator assembly for endpoint detection systems
APPLIED MATERIALS INC0 citations59
US11719952B2Aug 8, 2023
Adjustable achromatic collimator assembly for endpoint detection systems
APPLIED MATERIALS INC1 citations59
US10170280B2Jan 1, 2019
Plasma reactor having an array of plural individually controlled gas injectors arranged along a circular side wall
APPLIED MATERIALS INC0 citations51
US7635546B2Dec 22, 2009
Phase shifting photomask and a method of fabricating thereof
APPLIED MATERIALS INC1 citations49
GRIMBERGEN MICHAEL N
3 patentsUS9378930B2Jun 28, 2016
Inductively coupled plasma reactor having RF phase control and methods of use thereof
GRIMBERGEN MICHAEL N7 citations81
US8961804B2Feb 24, 2015
Etch rate detection for photomask etching
GRIMBERGEN MICHAEL N0 citations50
US8778204B2Jul 15, 2014
Methods for reducing photoresist interference when monitoring a target layer in a plasma process
GRIMBERGEN MICHAEL N0 citations50