Inventor
HAN JIN HEE
KR23 patents
⚠️ This page may combine multiple inventors who share the name “HAN JIN HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOREA ELECTRONICS TELECOMM
6 patentsUS6853677B2Feb 8, 2005
Finger using time division method and rake receiver having the same
KOREA ELECTRONICS TELECOMM7 citations69
US8929545B2Jan 6, 2015
Surveillance video transmission apparatus and method and surveillance video receiving apparatus and method
KOREA ELECTRONICS TELECOMM2 citations62
US9235463B2Jan 12, 2016
Device and method for fault management of smart device
KOREA ELECTRONICS TELECOMM2 citations61
US8364956B2Jan 29, 2013
Security management server and image data managing method thereof
KOREA ELECTRONICS TELECOMM3 citations61
US9288054B2Mar 15, 2016
Method and apparatus for authenticating and managing application using trusted platform module
KOREA ELECTRONICS TELECOMM1 citations51
US9135449B2Sep 15, 2015
Apparatus and method for managing USIM data using mobile trusted module
KOREA ELECTRONICS TELECOMM0 citations40
ELECTRONICS & TELECOMMUNICATIONS RES INST
4 patentsUS10915633B2Feb 9, 2021
Method and apparatus for device security verification utilizing a virtual trusted computing base
ELECTRONICS & TELECOMMUNICATIONS RES INST2 citations72
US10511488B2Dec 17, 2019
Device, system and method for performing integrity verification based on distributed delegator
ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations62
US10798115B2Oct 6, 2020
Apparatus and method for detecting malicious device based on swarm intelligence
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations41
US10635839B2Apr 28, 2020
Fixed-location IoT device for protecting secure storage access information and method for protecting secure storage access information of fixed-location IoT device
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations41
SAMSUNG ELECTRONICS CO LTD
3 patentsUS9735158B2Aug 15, 2017
Semiconductor devices having bridge layer and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10147723B2Dec 4, 2018
Semiconductor devices having bridge layer and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12482681B2Nov 25, 2025
Semiconductor inspection method including heating a top surface of a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations40