Inventor
PHELPS JR DOUGLAS W
US9 patents
Patents
9 patentsUS4796078AJan 3, 1989
Peripheral/area wire bonding technique
IBM166 citations96
US4878108AOct 31, 1989
Heat dissipation package for integrated circuits
IBM58 citations95
US4862245AAug 29, 1989
Package semiconductor chip
IBM670 citations95
US4447857AMay 8, 1984
Substrate with multiple type connections
IBM101 citations95
US4965654AOct 23, 1990
Semiconductor package with ground plane
IBM80 citations94
US4821945AApr 18, 1989
Single lead automatic clamping and bonding system
IBM92 citations91
US4551912ANov 12, 1985
Highly integrated universal tape bonding
IBM30 citations91
US4907734AMar 13, 1990
Method of bonding gold or gold alloy wire to lead tin solder
IBM42 citations89
US4417120ANov 22, 1983
Percussive arc welding
IBM10 citations71