Inventor
ALI ANWAR
US31 patents
⚠️ This page may combine multiple inventors who share the name “ALI ANWAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
18 patentsUS6836026B1Dec 28, 2004
Integrated circuit design for both input output limited and core limited integrated circuits
LSI LOGIC CORP64 citations92
US6798069B1Sep 28, 2004
Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors
LSI LOGIC CORP22 citations92
US6671865B1Dec 30, 2003
High density input output
LSI LOGIC CORP41 citations92
US6657870B1Dec 2, 2003
Die power distribution system
LSI LOGIC CORP56 citations92
US6591410B1Jul 8, 2003
Six-to-one signal/power ratio bump and trace pattern for flip chip design
LSI LOGIC CORP21 citations88
US8350375B2Jan 8, 2013
Flipchip bump patterns for efficient I-mesh power distribution schemes
LSI LOGIC CORP11 citations82
US7117467B2Oct 3, 2006
Methods for optimizing package and silicon co-design of integrated circuit
LSI LOGIC CORP12 citations81
US7107561B2Sep 12, 2006
Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
LSI LOGIC CORP6 citations63
US6998638B2Feb 14, 2006
Test structure for detecting bonding-induced cracks
LSI LOGIC CORP2 citations62
US6781150B2Aug 24, 2004
Test structure for detecting bonding-induced cracks
LSI LOGIC CORP4 citations62
US6768142B2Jul 27, 2004
Circuit component placement
LSI LOGIC CORP5 citations62
US6815812B2Nov 9, 2004
Direct alignment of contacts
LSI LOGIC CORP5 citations61
US6784102B2Aug 31, 2004
Laterally interconnecting structures
LSI LOGIC CORP6 citations61
US7075179B1Jul 11, 2006
System for implementing a configurable integrated circuit
LSI LOGIC CORP6 citations60
US6781228B2Aug 24, 2004
Donut power mesh scheme for flip chip package
LSI LOGIC CORP3 citations60
US6704918B1Mar 9, 2004
Integrated circuit routing
LSI LOGIC CORP6 citations60
US7328417B2Feb 5, 2008
Cell-based method for creating slotted metal in semiconductor designs
LSI LOGIC CORP1 citations51
US6683476B2Jan 27, 2004
Contact ring architecture
LSI LOGIC CORP0 citations40
LSI CORP
5 patentsUS7554133B1Jun 30, 2009
Pad current splitting
LSI CORP8 citations83
US7863716B2Jan 4, 2011
Method and apparatus of power ring positioning to minimize crosstalk
LSI CORP4 citations62
US7569472B2Aug 4, 2009
Method and apparatus of power ring positioning to minimize crosstalk
LSI CORP4 citations62
US7430730B2Sep 30, 2008
Disabling unused IO resources in platform-based integrated circuits
LSI CORP2 citations58
US7737564B2Jun 15, 2010
Power configuration method for structured ASICs
LSI CORP0 citations41
AVAGO TECH INT SALES PTE LID
3 patentsUS12450178B2Oct 21, 2025
Aggregation of multiple memory modules for a system-on-chip
AVAGO TECH INT SALES PTE LID1 citations60
US12588506B2Mar 24, 2026
Stacked semiconductor method and apparatus
AVAGO TECH INT SALES PTE LID0 citations46
US12536111B2Jan 27, 2026
Systems and methods for semiconductor devices with extended high-bandwidth memory (HBM) offsets
AVAGO TECH INT SALES PTE LID0 citations38
CUBIC PHARMACEUTICALS LTD
3 patentsUS10881616B2Jan 5, 2021
Process of preparing active pharmaceutical ingredient salts
CUBIC PHARMACEUTICALS LTD0 citations38
US12138350B2Nov 12, 2024
Method of producing a extruded composition
CUBIC PHARMACEUTICALS LTD0 citations37
US11246833B2Feb 15, 2022
Method of producing a granulated composition
CUBIC PHARMACEUTICALS LTD0 citations37