P

Inventor

NAKAI SHUNSUKE

JP21 patents
⚠️ This page may combine multiple inventors who share the name “NAKAI SHUNSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EBARA CORP

15 patents
US6785010B2Aug 31, 2004

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

EBARA CORP35 citations96
US7645181B2Jan 12, 2010

Polishing state monitoring apparatus and polishing apparatus

EBARA CORP13 citations92
US7438627B2Oct 21, 2008

Polishing state monitoring method

EBARA CORP17 citations92
US7214122B2May 8, 2007

Substrate polishing apparatus

EBARA CORP19 citations92
US7072050B2Jul 4, 2006

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

EBARA CORP29 citations92
US6758723B2Jul 6, 2004

Substrate polishing apparatus

EBARA CORP20 citations92
US6657737B2Dec 2, 2003

Method and apparatus for measuring film thickness

EBARA CORP40 citations92
US7675634B2Mar 9, 2010

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

EBARA CORP4 citations74
US7585204B2Sep 8, 2009

Substrate polishing apparatus

EBARA CORP4 citations74
US7428064B2Sep 23, 2008

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

EBARA CORP4 citations74
US7547242B2Jun 16, 2009

Substrate polishing apparatus

EBARA CORP7 citations73
US8342907B2Jan 1, 2013

Polishing state monitoring method

EBARA CORP3 citations62
US7507144B2Mar 24, 2009

Substrate polishing apparatus

EBARA CORP3 citations62
US10207390B2Feb 19, 2019

Processing end point detection method, polishing method, and polishing apparatus

EBARA CORP1 citations61
US7510460B2Mar 31, 2009

Substrate polishing apparatus

EBARA CORP0 citations52

SHIMADZU CORP

4 patents

SHIMIZU NOBURU

1 patent

MEGACHIPS CORP

1 patent