Inventor

MAESATO HIDETOSHI

JP5 patents

⚠️ This page may combine multiple inventors who share the name “MAESATO HIDETOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOKYO TUNGSTEN KK

4 patents

US6475429B2Nov 5, 2002

Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same

TOKYO TUNGSTEN KK19 citations91

US6271585B1Aug 7, 2001

Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same

TOKYO TUNGSTEN KK32 citations91

US6693353B1Feb 17, 2004

Semiconductor package and method for producing heat-radiating substrate for it

TOKYO TUNGSTEN KK13 citations82

US6926861B2Aug 9, 2005

Semiconductor package and method for producing heat-radiating substrate for it

TOKYO TUNGSTEN KK6 citations71

ALMT CORP

1 patent

US7083759B2Aug 1, 2006

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

ALMT CORP10 citations71