Inventor

SAKIMAE KENJI

JP2 patents

Patents

2 patents

US6693353B1Feb 17, 2004

Semiconductor package and method for producing heat-radiating substrate for it

TOKYO TUNGSTEN KK13 citations82

US6926861B2Aug 9, 2005

Semiconductor package and method for producing heat-radiating substrate for it

TOKYO TUNGSTEN KK6 citations71