Inventor
OZAWA TAKUO
JP3 patents
Patents
3 patentsUS6241145B1Jun 5, 2001
Lead-free solder joining method and electronic module manufactured by using the method
MITSUBISHI ELECTRIC CORP41 citations90
US7078330B2Jul 18, 2006
Metal electrode and bonding method using the metal electrode
MITSUBISHI ELECTRIC CORP6 citations60
US6722614B2Apr 20, 2004
Satellite deployment structure
MITSUBISHI ELECTRIC CORP4 citations60