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Inventor

ROBINSON MARC E

US12 patents
⚠️ This page may combine multiple inventors who share the name “ROBINSON MARC E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCELREA SIMON J S

4 patents
US8178978B2May 15, 2012

Support mounted electrically interconnected die assembly

MCELREA SIMON J S77 citations96
US8723332B2May 13, 2014

Electrically interconnected stacked die assemblies

MCELREA SIMON J S35 citations92
US8629543B2Jan 14, 2014

Electrically interconnected stacked die assemblies

MCELREA SIMON J S19 citations90
US9305862B2Apr 5, 2016

Support mounted electrically interconnected die assembly

MCELREA SIMON J S7 citations82

INVENSAS CORP

3 patents
US9824999B2Nov 21, 2017

Semiconductor die mount by conformal die coating

INVENSAS CORP1 citations60
US9252116B2Feb 2, 2016

Semiconductor die mount by conformal die coating

INVENSAS CORP2 citations60
US8729690B2May 20, 2014

Assembly having stacked die mounted on substrate

INVENSAS CORP0 citations49

CUBIC MEMORY INC

2 patents
US6271598B1Aug 7, 2001

Conductive epoxy flip-chip on chip

CUBIC MEMORY INC114 citations95
US6098278AAug 8, 2000

Method for forming conductive epoxy flip-chip on chip

CUBIC MEMORY INC91 citations95

VERTICAL CIRCUITS INC

1 patent
US7535109B2May 19, 2009

Die assembly having electrical interconnect

VERTICAL CIRCUITS INC38 citations90

CRANE SCOTT JAY

1 patent
US8704379B2Apr 22, 2014

Semiconductor die mount by conformal die coating

CRANE SCOTT JAY14 citations87

VERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC

1 patent
US8357999B2Jan 22, 2013

Assembly having stacked die mounted on substrate

VERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC14 citations87