Inventor

AYUKAWA MICHAEL C

CH2 patents

⚠️ This page may combine multiple inventors who share the name “AYUKAWA MICHAEL C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ARCHER III VANCE D

1 patent

US8319343B2Nov 27, 2012

Routing under bond pad for the replacement of an interconnect layer

ARCHER III VANCE D13 citations78

AGERE SYSTEMS INC

1 patent

US7566964B2Jul 28, 2009

Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures

AGERE SYSTEMS INC2 citations57