Inventor
BACHMAN MARK A
US10 patents
⚠️ This page may combine multiple inventors who share the name “BACHMAN MARK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BACHMAN MARK A
4 patentsUS8492911B2Jul 23, 2013
Stacked interconnect heat sink
BACHMAN MARK A34 citations92
US8987137B2Mar 24, 2015
Method of fabrication of through-substrate vias
BACHMAN MARK A25 citations90
US8742535B2Jun 3, 2014
Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
BACHMAN MARK A13 citations82
US8507317B2Aug 13, 2013
Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
BACHMAN MARK A5 citations71
LSI CORP
4 patentsUS8378485B2Feb 19, 2013
Solder interconnect by addition of copper
LSI CORP16 citations92
US9613847B2Apr 4, 2017
Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
LSI CORP3 citations71
US8580621B2Nov 12, 2013
Solder interconnect by addition of copper
LSI CORP2 citations62
US9054064B2Jun 9, 2015
Stacked interconnect heat sink
LSI CORP0 citations52