P

Inventor

KAPOOR ASHOK K

US87 patents
⚠️ This page may combine multiple inventors who share the name “KAPOOR ASHOK K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI LOGIC CORP

36 patents
US6407434B1Jun 18, 2002

Hexagonal architecture

LSI LOGIC CORP245 citations99
US5973376AOct 26, 1999

Architecture having diamond shaped or parallelogram shaped cells

LSI LOGIC CORP157 citations99
US5822214AOct 13, 1998

CAD for hexagonal architecture

LSI LOGIC CORP297 citations99
US5777360AJul 7, 1998

Hexagonal field programmable gate array architecture

LSI LOGIC CORP338 citations99
US5742086AApr 21, 1998

Hexagonal DRAM array

LSI LOGIC CORP162 citations99
US5650653AJul 22, 1997

Microelectronic integrated circuit including triangular CMOS "nand" gate device

LSI LOGIC CORP175 citations99
US5470801ANov 28, 1995

Low dielectric constant insulation layer for integrated circuit structure and method of making same

LSI LOGIC CORP176 citations99
US5889329AMar 30, 1999

Tri-directional interconnect architecture for SRAM

LSI LOGIC CORP135 citations98
US5756395AMay 26, 1998

Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures

LSI LOGIC CORP108 citations98
US5663076ASep 2, 1997

Automating photolithography in the fabrication of integrated circuits

LSI LOGIC CORP101 citations98
US5640049AJun 17, 1997

Metal interconnect structures for use with integrated circuit devices to form integrated circuit structures

LSI LOGIC CORP116 citations98
US5498558AMar 12, 1996

Integrated circuit structure having floating electrode with discontinuous phase of metal silicide formed on a surface thereof and process for making same

LSI LOGIC CORP109 citations98
US5872380AFeb 16, 1999

Hexagonal sense cell architecture

LSI LOGIC CORP106 citations97
US5877045AMar 2, 1999

Method of forming a planar surface during multi-layer interconnect formation by a laser-assisted dielectric deposition

LSI LOGIC CORP73 citations96
US5864172AJan 26, 1999

Low dielectric constant insulation layer for integrated circuit structure and method of making same

LSI LOGIC CORP70 citations96
US5808330ASep 15, 1998

Polydirectional non-orthoginal three layer interconnect architecture

LSI LOGIC CORP54 citations96
US5789770AAug 4, 1998

Hexagonal architecture with triangular shaped cells

LSI LOGIC CORP53 citations96
US5650648AJul 22, 1997

Integrated circuit structure having floating electrode with discontinuous phase of metal silicide formed on a surface thereof and process for making same

LSI LOGIC CORP43 citations96
US5494859AFeb 27, 1996

Low dielectric constant insulation layer for integrated circuit structure and method of making same

LSI LOGIC CORP97 citations96
US5472901ADec 5, 1995

Process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps

LSI LOGIC CORP48 citations96
US6109775AAug 29, 2000

Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon

LSI LOGIC CORP60 citations93
US6097073AAug 1, 2000

Triangular semiconductor or gate

LSI LOGIC CORP27 citations93
US5985746ANov 16, 1999

Process for forming self-aligned conductive plugs in multiple insulation levels in integrated circuit structures and resulting product

LSI LOGIC CORP53 citations93
US5780350AJul 14, 1998

MOSFET device with improved LDD region and method of making same

LSI LOGIC CORP46 citations93
US5663590ASep 2, 1997

Product of process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps

LSI LOGIC CORP28 citations93
US5614428AMar 25, 1997

Process and structure for reduction of channeling during implantation of source and drain regions in formation of MOS integrated circuit structures

LSI LOGIC CORP32 citations93
US5598026AJan 28, 1997

Low dielectric constant insulation layer for integrated circuit structure and method of making same

LSI LOGIC CORP34 citations93
US5543643AAug 6, 1996

Combined JFET and MOS transistor device, circuit

LSI LOGIC CORP31 citations93
US5393712AFeb 28, 1995

Process for forming low dielectric constant insulation layer on integrated circuit structure

LSI LOGIC CORP50 citations93
US6861739B1Mar 1, 2005

Minimum metal consumption power distribution network on a bonded die

LSI LOGIC CORP30 citations92
US6529400B1Mar 4, 2003

Source pulsed, dynamic threshold complementary metal oxide semiconductor static RAM cells

LSI LOGIC CORP35 citations92
US6312980B1Nov 6, 2001

Programmable triangular shaped device having variable gain

LSI LOGIC CORP26 citations92
US5835986ANov 10, 1998

Electrostatic discharge (ESD) structure and buffer driver structure for providing ESD and latchup protection for integrated circuit structures in minimized I/O space

LSI LOGIC CORP26 citations91
US5789783AAug 4, 1998

Multilevel metallization structure for integrated circuit I/O lines for increased current capacity and ESD protection

LSI LOGIC CORP19 citations91
US5864165AJan 26, 1999

Triangular semiconductor NAND gate

LSI LOGIC CORP18 citations84
US6117736ASep 12, 2000

Method of fabricating insulated-gate field-effect transistors having different gate capacitances

LSI LOGIC CORP15 citations82

NAT SEMICONDUCTOR CORP

6 patents

DSM SOLUTIONS INC

3 patents

FAIRCHILD CAMERA INSTR CO

2 patents

FAIRCHILD SEMICONDUCTOR

1 patent

(unassigned)

1 patent

GOLD STANDARD SIMULATIONS LTD

1 patent

Showing the top 50 of 87 patents by PatentIndex Score.