Inventor
ANDROS FRANK E
US8 patents
Patents
8 patentsUS5519936AMay 28, 1996
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM113 citations96
US6219238B1Apr 17, 2001
Structure for removably attaching a heat sink to surface mount packages
IBM61 citations94
US5633533AMay 27, 1997
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM58 citations94
US5561323AOct 1, 1996
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM67 citations94
US5367435ANov 22, 1994
Electronic package structure and method of making same
IBM106 citations94
US4313492AFeb 2, 1982
Micro helix thermo capsule
IBM28 citations79
US4291364ASep 22, 1981
Air-cooled hybrid electronic package
IBM24 citations75
US4212349AJul 15, 1980
Micro bellows thermo capsule
IBM17 citations70