Inventor
LEE SHIN-AE
KR21 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHIN-AE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS7002207B2Feb 21, 2006
Field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD74 citations98
US7615429B2Nov 10, 2009
Methods of fabricating field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD39 citations96
US7148527B2Dec 12, 2006
Semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD54 citations96
US7381601B2Jun 3, 2008
Methods of fabricating field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD24 citations92
US7285466B2Oct 23, 2007
Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channels
SAMSUNG ELECTRONICS CO LTD28 citations92
US7122431B2Oct 17, 2006
Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD20 citations92
US7071517B2Jul 4, 2006
Self-aligned semiconductor contact structures and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD28 citations92
US7026688B2Apr 11, 2006
Field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD22 citations92
US6940129B2Sep 6, 2005
Double gate MOS transistors
SAMSUNG ELECTRONICS CO LTD20 citations92
US7473963B2Jan 6, 2009
Metal oxide semiconductor (MOS) transistors having three dimensional channels
SAMSUNG ELECTRONICS CO LTD8 citations84
US7397131B2Jul 8, 2008
Self-aligned semiconductor contact structures
SAMSUNG ELECTRONICS CO LTD12 citations84
US7129541B2Oct 31, 2006
Field effect transistors including vertically oriented gate electrodes extending inside vertically protruding portions of a substrate
SAMSUNG ELECTRONICS CO LTD13 citations84
US7015549B2Mar 21, 2006
Integrated circuit structures including epitaxial silicon layers that extend from an active region through an insulation layer to a substrate
SAMSUNG ELECTRONICS CO LTD13 citations84
US7154154B2Dec 26, 2006
MOS transistors having inverted T-shaped gate electrodes
SAMSUNG ELECTRONICS CO LTD8 citations74
US7132349B2Nov 7, 2006
Methods of forming integrated circuits structures including epitaxial silicon layers in active regions
SAMSUNG ELECTRONICS CO LTD9 citations74
US7541656B2Jun 2, 2009
Semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009
Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD4 citations63
US6875666B2Apr 5, 2005
Methods of manufacturing transistors and transistors having an anti-punchthrough region
SAMSUNG ELECTRONICS CO LTD2 citations60
US7871914B2Jan 18, 2011
Methods of fabricating semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD0 citations52
US7534707B2May 19, 2009
MOS Transistors having inverted T-shaped gate electrodes and fabrication methods thereof
SAMSUNG ELECTRONICS CO LTD0 citations52