P

Inventor

LEE SHIN-AE

KR21 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHIN-AE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

20 patents
US7002207B2Feb 21, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD74 citations98
US7615429B2Nov 10, 2009

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD39 citations96
US7148527B2Dec 12, 2006

Semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD54 citations96
US7381601B2Jun 3, 2008

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD24 citations92
US7285466B2Oct 23, 2007

Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD28 citations92
US7122431B2Oct 17, 2006

Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD20 citations92
US7071517B2Jul 4, 2006

Self-aligned semiconductor contact structures and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD28 citations92
US7026688B2Apr 11, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD22 citations92
US6940129B2Sep 6, 2005

Double gate MOS transistors

SAMSUNG ELECTRONICS CO LTD20 citations92
US7473963B2Jan 6, 2009

Metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD8 citations84
US7397131B2Jul 8, 2008

Self-aligned semiconductor contact structures

SAMSUNG ELECTRONICS CO LTD12 citations84
US7129541B2Oct 31, 2006

Field effect transistors including vertically oriented gate electrodes extending inside vertically protruding portions of a substrate

SAMSUNG ELECTRONICS CO LTD13 citations84
US7015549B2Mar 21, 2006

Integrated circuit structures including epitaxial silicon layers that extend from an active region through an insulation layer to a substrate

SAMSUNG ELECTRONICS CO LTD13 citations84
US7154154B2Dec 26, 2006

MOS transistors having inverted T-shaped gate electrodes

SAMSUNG ELECTRONICS CO LTD8 citations74
US7132349B2Nov 7, 2006

Methods of forming integrated circuits structures including epitaxial silicon layers in active regions

SAMSUNG ELECTRONICS CO LTD9 citations74
US7541656B2Jun 2, 2009

Semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009

Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD4 citations63
US6875666B2Apr 5, 2005

Methods of manufacturing transistors and transistors having an anti-punchthrough region

SAMSUNG ELECTRONICS CO LTD2 citations60
US7871914B2Jan 18, 2011

Methods of fabricating semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD0 citations52
US7534707B2May 19, 2009

MOS Transistors having inverted T-shaped gate electrodes and fabrication methods thereof

SAMSUNG ELECTRONICS CO LTD0 citations52

MANDO CORP

1 patent