Inventor
SHIN JUNGHOON
KR16 patents
⚠️ This page may combine multiple inventors who share the name “SHIN JUNGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
5 patentsUS7923304B2Apr 12, 2011
Integrated circuit packaging system with conductive pillars and method of manufacture thereof
STATS CHIPPAC LTD61 citations97
US7727875B2Jun 1, 2010
Grooving bumped wafer pre-underfill system
STATS CHIPPAC LTD21 citations92
US8030769B2Oct 4, 2011
Grooving bumped wafer pre-underfill system
STATS CHIPPAC LTD9 citations83
US7892072B2Feb 22, 2011
Method for directional grinding on backside of a semiconductor wafer
STATS CHIPPAC LTD7 citations81
US7838391B2Nov 23, 2010
Ultra thin bumped wafer with under-film
STATS CHIPPAC LTD2 citations62
SAMSUNG DISPLAY CO LTD
5 patentsUS10197719B2Feb 5, 2019
Display device
SAMSUNG DISPLAY CO LTD1 citations59
US12457868B2Oct 28, 2025
Display apparatus and method of manufacturing the same
SAMSUNG DISPLAY CO LTD0 citations49
US11803262B2Oct 31, 2023
Electronic apparatus and method for manufacturing the same
SAMSUNG DISPLAY CO LTD0 citations49
US10088625B2Oct 2, 2018
Backlight unit
SAMSUNG DISPLAY CO LTD0 citations48
US9927569B2Mar 27, 2018
Display device
SAMSUNG DISPLAY CO LTD0 citations40