Inventor

KITAE TAKASHI

JP43 patents

⚠️ This page may combine multiple inventors who share the name “KITAE TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KITAE TAKASHI

PANASONIC CORP

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Flip chip mounting method and bump forming method

Process for forming bumps and solder bump

Flip chip mounting process and flip chip assembly

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Flip chip mounting method and method for connecting substrates

Mounted body and method for manufacturing the same

Flip chip mounting method and bump forming method

Electronic component mounting method

Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates

Mounted body and method for manufacturing the same

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Mounted body and method for manufacturing the same

Method for forming conductive pattern and wiring board

Flip chip mounting method and bump forming method

Flip chip mounting process and flip chip assembly

Bump forming method and bump forming apparatus

Flip chip mounting method and method for connecting substrates

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Electronic component transporting method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Electronic part, an electronic part mounting element and a process for manufacturing such the articles

Conductive adhesive and connection structure using the same

Electronic component mounted member and repair method thereof

Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module

Electronic component mounted member and repair method thereof

Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same

Conductive adhesive and packaging structure using the same

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

Conductive adhesive and packaging structure using the same

Conductive adhesive and connection structure using the same

KITAE TAKASHI

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

Flip chip mounting method and bump forming method

Electronic component assembly

Flip-chip mounting resin composition and bump forming resin composition

NAKATANI SEIICHI

Semiconductor device having semiconductor elements formed inside a resin film substrate

Transistor having an organic semiconductor with a hollow space

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

MATSUSHITA ELECTRIC INDUSTIRAL

Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

SAWADA SUSUMU

Flip chip connection structure having powder-like conductive substance and method of producing the same

TANIGUCHI YASUSHI

Electrode structure and method for forming bump

KARASHIMA SEIJI

Bump forming method using self-assembling resin and a wall surface