Inventor
PARK DAE-GYU
US92 patents
⚠️ This page may combine multiple inventors who share the name “PARK DAE-GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
24 patentsUS8043920B2Oct 25, 2011
finFETS and methods of making same
IBM91 citations97
US7279413B2Oct 9, 2007
High-temperature stable gate structure with metallic electrode
IBM53 citations96
US9059016B1Jun 16, 2015
Lateral heterojunction bipolar transistors
IBM27 citations93
US7439128B2Oct 21, 2008
Method of creating deep trench capacitor using a P+ metal electrode
IBM22 citations93
US7084024B2Aug 1, 2006
Gate electrode forming methods using conductive hard mask
IBM40 citations93
US7023064B2Apr 4, 2006
Temperature stable metal nitride gate electrode
IBM32 citations93
US6909137B2Jun 21, 2005
Method of creating deep trench capacitor using a P+ metal electrode
IBM20 citations93
US7872303B2Jan 18, 2011
FinFET with longitudinal stress in a channel
IBM31 citations92
US7867839B2Jan 11, 2011
Method to reduce threshold voltage (Vt) in silicon germanium (SiGe), high-k dielectric-metal gate, p-type metal oxide semiconductor field effect transistors
IBM21 citations92
US7863126B2Jan 4, 2011
Fabrication of a CMOS structure with a high-k dielectric layer oxidizing an aluminum layer in PFET region
IBM25 citations92
US7504700B2Mar 17, 2009
Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method
IBM26 citations92
US7989298B1Aug 2, 2011
Transistor having V-shaped embedded stressor
IBM27 citations90
US9391171B2Jul 12, 2016
Fin field effect transistor including a strained epitaxial semiconductor shell
IBM5 citations84
US9306038B1Apr 5, 2016
Shallow extension junction
IBM10 citations84
US9034748B2May 19, 2015
Process variability tolerant hard mask for replacement metal gate finFET devices
IBM13 citations84
US9023697B2May 5, 2015
3D transistor channel mobility enhancement
IBM6 citations84
US8030716B2Oct 4, 2011
Self-aligned CMOS structure with dual workfunction
IBM8 citations84
US7947549B2May 24, 2011
Gate effective-workfunction modification for CMOS
IBM7 citations84
US7683418B2Mar 23, 2010
High-temperature stable gate structure with metallic electrode
IBM10 citations84
US7611979B2Nov 3, 2009
Metal gates with low charge trapping and enhanced dielectric reliability characteristics for high-k gate dielectric stacks
IBM8 citations84
US7893502B2Feb 22, 2011
Threshold voltage improvement employing fluorine implantation and adjustment oxide layer
IBM12 citations83
US7485910B2Feb 3, 2009
Simplified vertical array device DRAM/eDRAM integration: method and structure
IBM7 citations74
US9711416B2Jul 18, 2017
Fin field effect transistor including a strained epitaxial semiconductor shell
IBM2 citations73
US9275907B2Mar 1, 2016
3D transistor channel mobility enhancement
IBM5 citations73
HYUNDAI ELECTRONICS IND
9 patentsUS6664160B2Dec 16, 2003
Gate structure with high K dielectric
HYUNDAI ELECTRONICS IND60 citations96
US6511875B2Jan 28, 2003
Method for making high K dielectric gate for semiconductor device
HYUNDAI ELECTRONICS IND18 citations93
US6391727B1May 21, 2002
Method of manufacturing a semiconductor device utilizing a(Al2O3)X-(TiO2)1-X gate dielectric film
HYUNDAI ELECTRONICS IND21 citations93
US6524918B2Feb 25, 2003
Method for manufacturing a gate structure incorporating therein aluminum oxide as a gate dielectric
HYUNDAI ELECTRONICS IND21 citations92
US6579767B2Jun 17, 2003
Method for forming aluminum oxide as a gate dielectric
HYUNDAI ELECTRONICS IND47 citations90
US6514826B1Feb 4, 2003
Method of forming a gate electrode in a semiconductor device
HYUNDAI ELECTRONICS IND9 citations74
US6391724B1May 21, 2002
Method for manufacturing a gate structure incorporating aluminum oxide as a gate dielectric
HYUNDAI ELECTRONICS IND12 citations74
US6355548B1Mar 12, 2002
Method for manufacturing a gate structure incorporated therein a high K dielectric
HYUNDAI ELECTRONICS IND13 citations74
US6171941B1Jan 9, 2001
Method for fabricating capacitor of semiconductor memory device using titanium aluminum nitride as diffusion-inhibiting layer
HYUNDAI ELECTRONICS IND8 citations74
HYNIX SEMICONDUCTOR INC
6 patentsUS6506676B2Jan 14, 2003
Method of manufacturing semiconductor devices with titanium aluminum nitride work function
HYNIX SEMICONDUCTOR INC98 citations98
US6828185B2Dec 7, 2004
CMOS of semiconductor device and method for manufacturing the same
HYNIX SEMICONDUCTOR INC20 citations93
US6768179B2Jul 27, 2004
CMOS of semiconductor device and method for manufacturing the same
HYNIX SEMICONDUCTOR INC21 citations93
US6642132B2Nov 4, 2003
Cmos of semiconductor device and method for manufacturing the same
HYNIX SEMICONDUCTOR INC25 citations93
US7157359B2Jan 2, 2007
Method of forming a metal gate in a semiconductor device using atomic layer deposition process
HYNIX SEMICONDUCTOR INC16 citations84
US6448166B2Sep 10, 2002
Method for forming a gate for semiconductor devices
HYNIX SEMICONDUCTOR INC11 citations74
CAI JIN
3 patentsUS8586441B1Nov 19, 2013
Germanium lateral bipolar junction transistor
CAI JIN32 citations92
US8558282B1Oct 15, 2013
Germanium lateral bipolar junction transistor
CAI JIN26 citations92
US8557670B1Oct 15, 2013
SOI lateral bipolar junction transistor having a wide band gap emitter contact
CAI JIN22 citations92
CHAN KEVIN K
3 patentsUS8299535B2Oct 30, 2012
Delta monolayer dopants epitaxy for embedded source/drain silicide
CHAN KEVIN K9 citations84
US8410544B2Apr 2, 2013
finFETs and methods of making same
CHAN KEVIN K10 citations83
US9105741B2Aug 11, 2015
Method of replacement source/drain for 3D CMOS transistors
CHAN KEVIN K4 citations73
YUHAN CORP
2 patentsHEKMATSHOAR-TABARI BAHMAN
1 patentYIN HAIZHOU
1 patentCHEN XIANGDONG
1 patentShowing the top 50 of 92 patents by PatentIndex Score.