Inventor
YOON BO-UN
KR105 patents
⚠️ This page may combine multiple inventors who share the name “YOON BO-UN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
35 patentsUS6626968B2Sep 30, 2003
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD53 citations96
US8344385B2Jan 1, 2013
Vertical-type semiconductor device
SAMSUNG ELECTRONICS CO LTD43 citations94
US6914001B2Jul 5, 2005
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
SAMSUNG ELECTRONICS CO LTD20 citations93
US6610596B1Aug 26, 2003
Method of forming metal interconnection using plating and semiconductor device manufactured by the method
SAMSUNG ELECTRONICS CO LTD33 citations93
US6887137B2May 3, 2005
Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
SAMSUNG ELECTRONICS CO LTD28 citations92
US6517412B2Feb 11, 2003
Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same
SAMSUNG ELECTRONICS CO LTD40 citations92
US7531456B2May 12, 2009
Method of forming self-aligned double pattern
SAMSUNG ELECTRONICS CO LTD29 citations91
US9947672B2Apr 17, 2018
Semiconductor devices including a dummy gate structure on a fin
SAMSUNG ELECTRONICS CO LTD4 citations84
US8038508B2Oct 18, 2011
Apparatus for polishing a wafer and method for detecting a polishing end point by the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US7196010B2Mar 27, 2007
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD16 citations84
US9659940B2May 23, 2017
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations83
US9627542B2Apr 18, 2017
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations83
US9305825B2Apr 5, 2016
Methods of fabricating semiconductor devices including fin-shaped active regions
SAMSUNG ELECTRONICS CO LTD7 citations83
US6335287B1Jan 1, 2002
Method of forming trench isolation regions
SAMSUNG ELECTRONICS CO LTD14 citations83
US8053845B2Nov 8, 2011
Semiconductor device including dummy gate part and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations82
US7678625B2Mar 16, 2010
Methods of fabricating semiconductor devices including channel layers having improved defect density and surface roughness characteristics
SAMSUNG ELECTRONICS CO LTD8 citations82
US6930054B2Aug 16, 2005
Slurry composition for use in chemical mechanical polishing of metal wiring
SAMSUNG ELECTRONICS CO LTD13 citations82
US10943908B2Mar 9, 2021
Method of forming semiconductor device
SAMSUNG ELECTRONICS CO LTD7 citations79
US10032890B2Jul 24, 2018
Method of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations77
US7670942B2Mar 2, 2010
Method of fabricating self-aligned contact pad using chemical mechanical polishing process
SAMSUNG ELECTRONICS CO LTD6 citations74
US6855267B2Feb 15, 2005
Chemical mechanical polishing slurry
SAMSUNG ELECTRONICS CO LTD10 citations74
US6514862B2Feb 4, 2003
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US6117766ASep 12, 2000
Method of forming contact plugs in a semiconductor device
SAMSUNG ELECTRONICS CO LTD9 citations74
US10096605B2Oct 9, 2018
Semiconductor devices including a dummy gate structure on a fin
SAMSUNG ELECTRONICS CO LTD3 citations73
US9136135B2Sep 15, 2015
Method of fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations73
US6121146ASep 19, 2000
Method for forming contact plugs of a semiconductor device
SAMSUNG ELECTRONICS CO LTD10 citations73
US10734380B2Aug 4, 2020
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10192973B2Jan 29, 2019
Methods of forming semiconductor devices including trench walls having multiple slopes
SAMSUNG ELECTRONICS CO LTD5 citations72
US10090190B2Oct 2, 2018
Methods of fabricating semiconductor devices including fin-shaped active regions
SAMSUNG ELECTRONICS CO LTD2 citations72
US6548388B2Apr 15, 2003
Semiconductor device including gate electrode having damascene structure and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations72
US10403640B2Sep 3, 2019
Semiconductor devices including insulating capping structures
SAMSUNG ELECTRONICS CO LTD3 citations71
US10128246B2Nov 13, 2018
Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin
SAMSUNG ELECTRONICS CO LTD3 citations71
US10109529B2Oct 23, 2018
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations71
US11011526B2May 18, 2021
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations70
US9590073B2Mar 7, 2017
Methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations69
PARK SANG-JINE
7 patentsUS9299700B2Mar 29, 2016
Semiconductor devices including a dummy gate structure on a fin
PARK SANG-JINE33 citations97
US9755079B2Sep 5, 2017
Semiconductor devices including insulating gates and methods for fabricating the same
PARK SANG-JINE13 citations83
US9548309B2Jan 17, 2017
Semiconductor devices including a dummy gate structure on a fin
PARK SANG-JINE10 citations83
US9443979B2Sep 13, 2016
Semiconductor devices including trench walls having multiple slopes
PARK SANG-JINE7 citations83
US8673724B2Mar 18, 2014
Methods of fabricating semiconductor devices
PARK SANG-JINE9 citations83
US9704864B2Jul 11, 2017
Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin
PARK SANG-JINE14 citations82
US8803248B2Aug 12, 2014
Semiconductor devices and methods of manufacturing the same
PARK SANG-JINE5 citations73
KWON BYOUNG-HO
3 patentsUS8916460B1Dec 23, 2014
Semiconductor device and method for fabricating the same
KWON BYOUNG-HO74 citations96
US8398874B2Mar 19, 2013
Methods of manufacturing semiconductors using dummy patterns
KWON BYOUNG-HO8 citations83
US9190407B2Nov 17, 2015
Semiconductor device and method for fabricating the same
KWON BYOUNG-HO5 citations82
KANG DAE-HYUK
2 patentsYOUN YOUNG-SANG
1 patentOKI SEMICONDUCTOR CO LTD
1 patentJEONG JI MIN
1 patentShowing the top 50 of 105 patents by PatentIndex Score.