Inventor
FENG MIN-SHINN
TW4 patents
Patents
4 patentsUS6235608B1May 22, 2001
STI process by method of in-situ multilayer dielectric deposition
WINBOND ELECTRONICS CORP19 citations91
US6165886ADec 26, 2000
Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect
WINBOND ELECTRONICS CORP26 citations91
US6441465B2Aug 27, 2002
Scribe line structure for preventing from damages thereof induced during fabrication
WINBOND ELECTRONICS CORP19 citations82
US6033987AMar 7, 2000
Method for mapping and adjusting pressure distribution of CMP processes
WINBOND ELECTRONICS CORP18 citations78