Inventor
ASHLEY LEON
US3 patents
Patents
3 patentsUS6130161AOct 10, 2000
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM111 citations98
US6348731B1Feb 19, 2002
Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same
IBM77 citations95
US6287954B1Sep 11, 2001
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
IBM71 citations95