Inventor

TEUNISSEN MICHEL HENDRIKUS LAMBERTUS

NL3 patents

⚠️ This page may combine multiple inventors who share the name “TEUNISSEN MICHEL HENDRIKUS LAMBERTUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BESI NETHERLANDS BV

2 patents

US10720340B2Jul 21, 2020

Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components

BESI NETHERLANDS BV0 citations41

US10032653B2Jul 24, 2018

Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components

BESI NETHERLANDS BV0 citations41

FICO BV

1 patent

US7608486B2Oct 27, 2009

Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier

FICO BV1 citations41