Inventor · disambiguated record
Hung-Hsien Huang
Also filed as: HUANG HUNG-HSIEN
6 granted patents·4 pending applications·5 citations·filing 2012–2024
68Inventor score
Files withADVANCED SEMICONDUCTOR ENG6DELTA ELECTRONICS INC1LIAO CHIEN-NENG1NAT UNIV TSING HUA1WHETRON ELECTRONICS CO LTD1
Top patents by PatentIndex Score
10 records- 0193US12111114B2Heat transfer element, method for forming the same and semiconductor structure comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 8, 2024·5 cites·8 claims
- 0255US12425740B1Correction method, correction system and auxiliary method of correction procedure for panoramic image of shipWHETRON ELECTRONICS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0353US11482482B2Substrate structures, methods for forming the same and semiconductor device structures comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 25, 2022·0 cites·9 claims
- 0452US2024170364A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0551US2024334586A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0649US11139226B2Semiconductor package structure and assembly structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 0748US11205606B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
- 0844US11293984B2Detection circuit, detection method and uninterruptible power system using sameDELTA ELECTRONICS INC·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 0941US2013112909A1Highly efficient thermoelectric materialLIAO CHIEN-NENG·Filed 2012·Application pending·0 cites
- 1032US2017170378A1Thermoelectric moduleNAT UNIV TSING HUA·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →