P

Inventor

HINGERL KURT

AT9 patents
⚠️ This page may combine multiple inventors who share the name “HINGERL KURT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PLACH THOMAS

4 patents
US8975158B2Mar 10, 2015

Method for permanently bonding wafers

PLACH THOMAS7 citations80
US9252042B2Feb 2, 2016

Method for permanent bonding of wafers

PLACH THOMAS2 citations59
US9159717B2Oct 13, 2015

Method for permanently bonding wafers

PLACH THOMAS3 citations59
US10825793B2Nov 3, 2020

Method for permanently bonding wafers

PLACH THOMAS0 citations38

EV GROUP E THALLNER GMBH

3 patents
US11862466B2Jan 2, 2024

Method and device for bonding substrates

EV GROUP E THALLNER GMBH0 citations51
US10971365B2Apr 6, 2021

Method and device for bonding substrates

EV GROUP E THALLNER GMBH0 citations51
US10083933B2Sep 25, 2018

Method for permanent bonding of wafers

EV GROUP E THALLNER GMBH0 citations50

OSRAM OPTO SEMICONDUCTORS GMBH

1 patent
US11694977B2Jul 4, 2023

Method for producing a connection between component parts

OSRAM OPTO SEMICONDUCTORS GMBH5 citations66

MARTINSCHITZ KLAUS

1 patent
US10163681B2Dec 25, 2018

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

MARTINSCHITZ KLAUS3 citations66