Inventor

RASSEL RICHARD J

US52 patents

⚠️ This page may combine multiple inventors who share the name “RASSEL RICHARD J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RASSEL RICHARD J

IBM

CMOS imager array with recessed dielectric

Bond pad for wafer and package for CMOS imager

Pixel array, imaging sensor including the pixel array and digital camera including the imaging sensor

CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom

Image sensor including spatially different active and dark pixel interconnect patterns

Stacked imager package

Stacked imager package

CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom

Tunable temperature coefficient of resistance resistors and method of fabricating same

Image sensor cells

Optical sensor including stacked photodiodes

Silicide strapping in imager transfer gate device

High efficiency CMOS image sensor pixel employing dynamic voltage supply

Delamination and crack resistant image sensor structures and methods

Tunable temperature coefficient of resistance resistors and method of fabricating same

Optical sensor including stacked photosensitive diodes

Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor

Pixel sensor cell with hold node for leakage cancellation and methods of manufacture and design structure

Image sensor including spatially different active and dark pixel interconnect patterns

Stacked imager package

High efficiency CMOS image sensor pixel employing dynamic voltage supply

Semiconductor-insulator-silicide capacitor

Pixel sensor cell with frame storage capability

Pixel sensor cell with frame storage capability

Image sensor monitor structure in scribe area

Thick bond pad for chip with cavity package

Photoconductor-on-active pixel device

High surface area aluminum bond pad for through-wafer connections to an electronic package

Image sensor cells

High surface area aluminum bond pad for through-wafer connections to an electronic package

Structures for preventing dicing damage

IC chip and design structure including stitched circuitry region boundary identification

Stitched circuitry region boundary identification for stitched IC chip layout

Stitched IC chip layout design structure

GAMBINO JEFFREY P

Interlevel conductive light shield

Method of fabricating photoconductor-on-active pixel device

Intralevel conductive light shield

Interlevel conductive light shield

Thick bond pad for chip with cavity package

Delamination and crack resistant image sensor structures and methods

ADKISSON JAMES W

CMOS pixel sensor cells with poly spacer transfer gates and methods of manufacture

Pixel sensor cell with hold node for leakage cancellation and methods of manufacture and design structure

Methods of forming silicide strapping in imager transfer gate device

GLOBALFOUNDRIES US INC

Device with dual isolation structure

Integrated circuit structure with through-metal through-substrate interconnect and method

ELLIS-MONAGHAN JOHN J

Pixel sensors of multiple pixel size and methods of implant dose control

Pixel sensors of multiple pixel size and methods of implant dose control

BH ELECTRONICS

Method of manufacturing an ultra-miniature magnetic device

HIBBELER JASON D

Image sensor pixel structure employing a shared floating diffusion

ACKERSON KRISTIN M

Anti-blooming pixel sensor cell with active neutral density filter, methods of manufacture, and design structure