Inventor
TANI MOTOAKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “TANI MOTOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
26 patentsUS7224046B2May 29, 2007
Multilayer wiring board incorporating carbon fibers and glass fibers
FUJITSU LTD60 citations98
US7002080B2Feb 21, 2006
Multilayer wiring board
FUJITSU LTD69 citations98
US6869665B2Mar 22, 2005
Wiring board with core layer containing inorganic filler
FUJITSU LTD64 citations94
US7640660B2Jan 5, 2010
Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers
FUJITSU LTD16 citations92
US7400035B2Jul 15, 2008
Semiconductor device having multilayer printed wiring board
FUJITSU LTD29 citations92
US5972807AOct 26, 1999
Photosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereof
FUJITSU LTD31 citations92
US5308929AMay 3, 1994
Via hole structure and process for formation thereof
FUJITSU LTD26 citations91
US7388157B2Jun 17, 2008
Printed wiring board
FUJITSU LTD13 citations84
US7017265B2Mar 28, 2006
Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby
FUJITSU LTD12 citations84
US6846549B2Jan 25, 2005
Multilayer printed wiring board
FUJITSU LTD14 citations84
US7246435B2Jul 24, 2007
Wiring board and method for fabricating the same
FUJITSU LTD5 citations74
US6045975AApr 4, 2000
Photosensitive, heat-resistant resin composition for forming patterns
FUJITSU LTD13 citations73
US6013419AJan 11, 2000
Process for using photosensitive, heat-resistant resin composition to form patterns
FUJITSU LTD11 citations73
US5362359ANov 8, 1994
Circuit board and process for producing same
FUJITSU LTD14 citations73
US5236772AAug 17, 1993
Circuit board and process for producing same
FUJITSU LTD7 citations73
US5231440AJul 27, 1993
Method of and apparatus for forming volume type phase hologram
FUJITSU LTD7 citations71
US5154994AOct 13, 1992
Method of and apparatus for forming volume type phase hologram
FUJITSU LTD12 citations71
US9312151B2Apr 12, 2016
Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member
FUJITSU LTD2 citations63
US9136172B2Sep 15, 2015
Method of manufacturing semiconductor device and method of manufacturing electronic assembly
FUJITSU LTD2 citations63
US7420130B2Sep 2, 2008
Wiring board and method for fabricating the same
FUJITSU LTD4 citations63
US5972562AOct 26, 1999
Visible radiation-curable solder resist compositions, and method for forming solder resist patterns
FUJITSU LTD6 citations62
US9318426B2Apr 19, 2016
Semiconductor device and method of manufacturing the same
FUJITSU LTD2 citations61
US9214361B2Dec 15, 2015
Semiconductor device manufacturing method and electronic device manufacturing method
FUJITSU LTD1 citations52
US7799604B2Sep 21, 2010
Semiconductor device having multilayer printed wiring board and manufacturing method of the same
FUJITSU LTD0 citations52
US6261741B1Jul 17, 2001
Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby
FUJITSU LTD1 citations52
US9177938B2Nov 3, 2015
Method for manufacturing semiconductor apparatus
FUJITSU LTD1 citations51