Inventor
SCHWANDNER JUERGEN
DE21 patents
⚠️ This page may combine multiple inventors who share the name “SCHWANDNER JUERGEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SCHWANDNER JUERGEN
15 patentsUS8647985B2Feb 11, 2014
Method for polishing a substrate composed of semiconductor material
SCHWANDNER JUERGEN6 citations71
US8388411B2Mar 5, 2013
Method for polishing the edge of a semiconductor wafer
SCHWANDNER JUERGEN2 citations61
US8389409B2Mar 5, 2013
Method for producing a semiconductor wafer
SCHWANDNER JUERGEN2 citations61
US8721390B2May 13, 2014
Method for the double-side polishing of a semiconductor wafer
SCHWANDNER JUERGEN3 citations60
US8338302B2Dec 25, 2012
Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layer
SCHWANDNER JUERGEN5 citations60
US8501028B2Aug 6, 2013
Method for grinding a semiconductor wafer
SCHWANDNER JUERGEN0 citations51
US8500516B2Aug 6, 2013
Method for polishing a semiconductor wafer
SCHWANDNER JUERGEN1 citations51
US10707069B2Jul 7, 2020
Method for polishing a semiconductor wafer
SCHWANDNER JUERGEN0 citations50
US8882565B2Nov 11, 2014
Method for polishing a semiconductor wafer
SCHWANDNER JUERGEN0 citations49
US8551870B2Oct 8, 2013
Method for producing an epitaxially coated semiconductor wafer
SCHWANDNER JUERGEN1 citations49
US8444455B2May 21, 2013
Polishing pad and method for polishing a semiconductor wafer
SCHWANDNER JUERGEN1 citations49
US9533394B2Jan 3, 2017
Method for the local polishing of a semiconductor wafer
SCHWANDNER JUERGEN0 citations40
US9224613B2Dec 29, 2015
Method for polishing both sides of a semiconductor wafer
SCHWANDNER JUERGEN0 citations40
US8685270B2Apr 1, 2014
Method for producing a semiconductor wafer
SCHWANDNER JUERGEN0 citations40
US8529315B2Sep 10, 2013
Method for producing a semiconductor wafer
SCHWANDNER JUERGEN0 citations40
SILTRONIC AG
6 patentsUS8376811B2Feb 19, 2013
Method for the double sided polishing of a semiconductor wafer
SILTRONIC AG13 citations83
US9193026B2Nov 24, 2015
Method for polishing a semiconductor material wafer
SILTRONIC AG4 citations72
US8376810B2Feb 19, 2013
Method for chemically grinding a semiconductor wafer on both sides
SILTRONIC AG1 citations51
US9308619B2Apr 12, 2016
Method for the double-side polishing of a semiconductor wafer
SILTRONIC AG0 citations40
US8343873B2Jan 1, 2013
Method for producing a semiconductor wafer
SILTRONIC AG0 citations40
US8647173B2Feb 11, 2014
Method for polishing a semiconductor wafer
SILTRONIC AG0 citations39