Inventor

YU ROY R

US65 patents

⚠️ This page may combine multiple inventors who share the name “YU ROY R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU ROY R

IBM

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

Four D device process and structure

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Lock and key structure for three-dimensional chip connection and process thereof

Antibacterial medical implant surface

Probe structure for physiological measurements using surface enhanced Raman spectroscopy

Antibacterial medical implant surface

Saccade and vergence tracking for distance auto focus adjustment

Saccade and vergence tracking for distance auto focus adjustment

Backside electrical contacts to buried power rails

Substrate thinning for a backside power distribution network

Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer

Backside power rail integration

Neuro-chemical sensor with inhibition of fouling on nano-electrode

Intelligent and disposable device for selective electrical stimulation of apoptosis

Intelligent and disposable device for selective electrical stimulation of apoptosis

Neuro-chemical sensor with inhibition of fouling on nano-electrode

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

Biosensor for multi-analyte characterization

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

Four D device process and structure

Enhanced adhesive materials and processes for 3D applications

Saccade and vergence tracking for distance auto focus adjustment

Biosensor package

Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer

Nanostructure featuring nano-topography with optimized electrical and biochemical properties

Structures and processes for void-free hybrid bonding

Cognitive optogenetics probe and analysis

Three-dimensional silicon-based comb probe

Antibacterial medical implant surface

Enhanced adhesive materials and processes for 3D applications

Biosensor for multi-analyte characterization

Antibacterial medical implant surface

On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling

FAROOQ MUKTA G

3D integrated circuit device fabrication with precisely controllable substrate removal

3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

3D integrated circuit device fabrication using interface wafer as permanent carrier

Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier

3D integrated circuit device fabrication with precisely controllable substrate removal

Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

COLGAN EVAN G

Processes for enhanced 3D integration and structures generated using the same

High memory density, high input/output bandwidth logic-memory structure and architecture

LIU FEI

Bow-balanced 3D chip stacking

HAENSCH WILFRIED

4D device process and structure

PURUSHOTHAMAN SAMPATH

3D integration method using SOI substrates and structures produced thereby

HEDRICK JAMES L

Enhanced adhesive materials and processes for 3D applications

YU ROY R

4D Device, process and structure

INTERNAT BUSHINESS MACHINES CORP

Process for enhanced 3D integration and structures generated using the same