Inventor
LI SYUFONG
TW3 patents
Patents
3 patentsUS12334465B2Jun 17, 2025
Semiconductor package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11984422B2May 14, 2024
Semiconductor package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12593711B2Mar 31, 2026
Bonding structure with stress buffer zone and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48