Inventor

OKABAYASHI HIDEKAZU

JP6 patents

⚠️ This page may combine multiple inventors who share the name “OKABAYASHI HIDEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

4 patents

US4558507ADec 17, 1985

Method for forming an aluminum film used as an interconnect in a semiconductor device

NEC CORP28 citations90

NIPPON ELECTRIC CO

2 patents

US4551908ANov 12, 1985

Process of forming electrodes and interconnections on silicon semiconductor devices

NIPPON ELECTRIC CO41 citations89

US4348746ASep 7, 1982

Semiconductor integrated circuit device having a plurality of insulated gate field effect transistors

NIPPON ELECTRIC CO32 citations87

OKABAYASHI HIDEKAZU

NEC CORP

Method of manufacturing semiconductor device

Copper interconnection

Method for fabricating semiconductor device

Method for forming an aluminum film used as an interconnect in a semiconductor device

NIPPON ELECTRIC CO

Process of forming electrodes and interconnections on silicon semiconductor devices

Semiconductor integrated circuit device having a plurality of insulated gate field effect transistors