Inventor

CAMACHO ZIGMUND RAMIREZ

SG160 patents

⚠️ This page may combine multiple inventors who share the name “CAMACHO ZIGMUND RAMIREZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CAMACHO ZIGMUND RAMIREZ

STATS CHIPPAC LTD

Integrated circuit package system with leadframe array

Stackable integrated circuit package system with recess

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Integrated circuit package system with interconnect support

Integrated circuit package system with heat sink

Integrated circuit packaging system with stacked device and method of manufacturing thereof

Integrated circuit package-in-package system with leads

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Integrated circuit package system with redistribution layer

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

Leadless integrated circuit packaging system and method of manufacture thereof

Multi-layer package-on-package system

Integrated circuit package system with dual connectivity

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

Integrated circuit package system with interconnection support and method of manufacture thereof

Multi-chip package system with multiple substrates

Integrated circuit package system with stiffener

Integrated circuit packaging system with interconnect and method of manufacture thereof

Integrated circuit package system with shielding

Semiconductor package system with die support pad

Integrated circuit package system with integral inner lead and paddle

Integrated circuit package system with top and bottom terminals

Integrated circuit package system with leadfinger support

Integrated circuit package with elevated edge leadframe

Integrated circuit package system with multiple molding

Overhang integrated circuit package system

Integrated circuit package system with adhesive restraint

Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ

Packaging system with hollow package and method for the same

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Integrated circuit package system with concave terminal

Integrated circuit package system with die on base package

Integrated circuit package system

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof

Integrated circuit packaging system with high lead count and method of manufacture thereof

Integrated circuit package system with shield and tie bar

Integrated circuit packaging system with interposer structure and method of manufacture thereof

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacturing thereof

BATHAN HENRY DESCALZO

Integrated circuit package system with integration port

Integrated circuit package in package system with adhesiveless package attach

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with protective coating and method of manufacture thereof

TAY LIONEL CHIEN HUI

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

Semiconductor package system with cut multiple lead pads

DO BYUNG TAI

Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof

PUNZALAN JEFFREY D

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

PAGAILA REZA ARGENTY

Package system with a shielded inverted internal stacking module and method of manufacture thereof