Inventor

BATHAN HENRY DESCALZO

SG105 patents

⚠️ This page may combine multiple inventors who share the name “BATHAN HENRY DESCALZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BATHAN HENRY DESCALZO

CAMACHO ZIGMUND RAMIREZ

Packaging system with hollow package and method for the same

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with high lead count and method of manufacture thereof

Integrated circuit package system with shield and tie bar

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacturing thereof

Fan-in interposer on lead frame for an integrated circuit package on package system

Integrated circuit packaging system with cap layer and method of manufacture thereof

Integrated circuit packaging system with plated leads and method of manufacture thereof

Etched recess package on package system

Integrated circuit packaging system with island terminals and method of manufacture thereof

Integrated circuit packaging system with flip chip and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with locking interconnects and method of manufacture thereof

Integrated circuit package system with extended corner leads

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

STATS CHIPPAC LTD

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Integrated circuit packaging system with stacked device and method of manufacturing thereof

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Integrated circuit package system with redistribution layer

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

Integrated circuit package system with interconnection support and method of manufacture thereof

Multi-chip package system with multiple substrates

Integrated circuit package system with shielding

Integrated circuit package system with integral inner lead and paddle

Integrated circuit package system with top and bottom terminals

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof

Mountable integrated circuit package system with substrate

Integrated circuit package system with isloated leads

BATHAN HENRY DESCALZO

Integrated circuit package system with integration port

Integrated circuit package in package system with adhesiveless package attach

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with protective coating and method of manufacture thereof

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

SEMTECH CORP

Side-solderable leadless package

Side-solderable leadless package

Side-solderable leadless package

Semiconductor device and method of forming mold degating structure for pre-molded substrate

TAY LIONEL CHIEN HUI

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

DO BYUNG TAI

Integrated circuit packaging system with trace protection layer and method of manufacture thereof

CAMACHO ZIGMUND R

System and apparatus for wafer level integration of components

PAGAILA REZA ARGENTY

Package system with a shielded inverted internal stacking module and method of manufacture thereof

ESPIRITU EMMANUEL

Integrated circuit packaging system with plated leads and method of manufacture thereof